Pasco Precision Corp.

Pasco Precision Advanced Semiconductor Manufacturing
 
 
PASCO PRECISION
01

Advanced Process Consumables & Components

Specializing in semiconductor critical processes, including Chemical Mechanical Planarization (CMP) and Electrochemical Plating (ECP), we focus on the R&D, design, and manufacturing of critical consumables and core components for advanced semiconductor manufacturing.

02

Precision Multi-Material Machining & Silicone Rubber Molding

With extensive expertise in high-precision CNC machining and advanced silicone rubber molding, we work with a wide range of materials, including engineering plastics, polyurethane (PU), and various metals. Our versatile manufacturing capabilities enable flexible customization to meet diverse customer requirements.

03

Real-Time Collaborative R&D & Continuous Improvement (CIP)

We provide real-time collaborative R&D and troubleshooting support, leveraging Continuous Improvement Programs (CIP) to address critical process challenges and resolve customer pain points. Our commitment to technical excellence has earned the long-term trust of leading Tier 1 wafer manufacturers worldwide and premier partners across Europe and the United States.

Empowering Growth

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APPLICATION FIELDS

Empowering Advanced Processes ‧ Driving Core Semiconductor Applications

 

Leveraging over 20 years of expertise in CMP and ECP technologies and comprehensive in-house manufacturing capabilities in Taiwan, PASCO Precision delivers critical consumables, customized high-end components, and proprietary engineering solutions to a wide range of advanced semiconductor applications.

 

 
01

12-Inch Advanced Wafer Manufacturing

Supporting core CMP and ECP processes in 12-inch wafer fabs, we provide critical consumables and components featuring excellent wear resistance, high surface flatness, and superior chemical resistance. Our solutions help enhance process repeatability and manufacturing stability.

CMP ECP Critical Consumables & Components 
 
02

Advanced Packaging & Heterogeneous Integration

Supporting advanced packaging technologies such as CoWoS and 3D IC, we provide highly customized materials and molded components tailored to meet the evolving requirements of advanced packaging processes.  

Customized Molded Components Solution
 
03

Process Optimization Equipment & Specialized Components

Leveraging our in-house R&D and customization capabilities, we develop high-precision process optimization equipment and critical components to help customers overcome production bottlenecks, improve equipment utilization, and enhance manufacturing efficiency.

In-House R&D Manufacturing Efficiency Enhancing
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